These two integrated graphics solutions should be based on Intel’s Xe3 graphics IP, currently present in “Panther Lake”. This would make the “Razor Lake-AX” nearly three times more powerful than the current Arc B390, which powers Intel’s PTL line. This suggests that “Razor Lake-AX” will be a large case, since the GPU chip would be around 162.84 mm². We also learned that Intel plans to reintroduce onboard memory with the upcoming “AX” chip. Although the company initially stated that the Core Ultra 200V “Lunar Lake” was the latest model with integrated memory, Intel has reportedly brought back integrated LPDDR5X/LPDDR6 memory for “Razor Lake-AX”. Note that the image below is simply an illustration.
Additionally, it’s unclear where Intel will manufacture this massive chip, but the large iGPU suggests a design powered by EMIB and Foveros 3D to interconnect various elements. Finally, the chip is expected to feature a BGA-4326 package with 4,326 pins, similar to that typically used by Intel Xeon processors. Previously, Intel was considering a “Nova Lake-AX” SoC featuring 48 Xe3 cores paired with a 28-core CPU cluster. However, this has been put on hold and the ‘AX’ generation will not debut with the next ‘Nova Lake’ generation. Intel plans to release the first batch of chips with the suffix “AX” after “Nova Lake,” and “Razor Lake-AX” is expected to arrive in 2028.
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